
Letšoao la epoxy le thibelang tšepe le phahameng le entsoe ka sekhomaretsi se thibelang mocheso o phahameng / thepa ea tšireletso ea tšepe / resin ea epoxy can tial le welding ea ultrasonic. Letšoao la RFID le thibelang tšepe le phahameng le na le boleng bo botle le ts'ebetso, 'me le loketse tlhahlobo ea lisebelisoa tsa motlakase tse bulehileng ka bongata, tlhahlobo ea tora le lipalo tse kholo, tlhahlobo ea lifti e kholo le e mahareng, tsamaiso ea pallet, sejana sa khatello se seholo, silindara ea liquefier, tsamaiso ea lisebelisoa tsa fektheri, tlhahlobo ea mola, tlhahlobo ea boleng ba borokho ba tšepe, tlhahlobo ea kotopo, tlhaiso ea mochini, poleiti ea laesense ea koloi, tsamaiso ea lijana tsa tšepe, le lisebelisoa tse fapaneng tsa motlakase tsa ntlo Ho latela sehlahisoa le likarolo tse ling.

| Thepa | Acrylic kapa e etselitsoeng ho latela tikoloho |
| Boholo | 41.5*41.5*5.5 mm |
| Boima ba 'mele | 9.5g |
| Litšebeletso tsa data | Lintlha le nomoro ea Laser li ka etsoa hore li lumellane le litlhoko tsa bareki |
| Melaoana | ISO/IEC 18000-6C le Sehlopha sa lefats'e sa EPC Sehlopha sa 1 sa Gen 2 |
| maqhubu a tshebetso | 920- 925MHz(CN) |
| Chip(IC) | Impinj / Monza 4QT |
| Khopolo | EPC: di-bits tse 128 |
| TID e ikhethang: Li-bits tse 64 | |
| Mosebelisi: Li-Bit tse 512 | |
| Sebaka sa ho bala | 2m e thehiloe holim'a 'mali o tsitsitseng (bokaholimo ba tšepe) |
| Sebaka sa ho bala | 1m e thehiloe ho sebali se tšoaroang ka letsoho sa R2000 (bokaholimo ba tšepe) |
| Ho boloka lintlha | Lilemo tse 10 |
| Mocheso o sebetsang | -40℃ ho isa ho +85℃ |
| Mocheso oa polokelo | -40℃ ho isa ho +85℃ |
| Ho kenya | lokisa ka sekurufo kapa sekhomaretsi sa 3M |
| Tiisetso | Selemo se le seng |
| Pakete: | 80 likhomphutha/lebokose, 15box/CNT(1200 likhomphutha), 11.4KG/CNT kapa Ho ya ka thomello ya nnete |
| Boholo ba lebokose | 48*21.5*18 cm |
| Likopo | Ho latela lisebelisoa, tsamaiso ea lisebelisoa tsa bongaka, ho latela lisebelisoa, lisebelisoa tsa mohala oa tlhahiso, Tlhahlobo ea Mokhoa oa IT / Energy. |