
| Mea waiwai | ABS + PC a i ʻole e like me ke kaiapuni |
| Nui | 134*20.5*13 mm |
| Kaumaha | 14.5g |
| Nā lawelawe ʻikepili | Hiki ke hoʻopilikino ʻia ka helu ʻikepili a me Laser ma nā koi o nā mea kūʻai aku |
| Nā Kūlana | ISO/IEC 18000-6C & EPC honua Papa 1 Gen 2 |
| alapine hana | 902- 928MHz(US) |
| Chip(IC) | Alien/Higgs-3 |
| Hoʻomanaʻo | EPC: 96-480 mau ʻāpana |
| TID kū hoʻokahi: 64 Bits | |
| Mea hoʻohana: 512 Bits | |
| Ka mamao heluhelu | 10~12(m) e pili ana i ka mea heluhelu paʻa (metalic surface) |
| Ka mamao heluhelu | 5~6(m) e pili ana i ka mea heluhelu kelepona (ka ʻili metala) |
| Paʻa ʻikepili | 10 makahiki |
| Hana wela | -40 ℃ a i + 85 ℃ |
| Ka mahana mālama | -40 ℃ a i + 85 ℃ |
| Hoʻokomo | hoʻopaʻa me ka wili a i ʻole 3M adhesive |
| Palapala hōʻoia | Hoʻokahi makahiki |
| Hoʻopili: | 50 pcs / ʻeke ʻeke, 10 ʻeke opp / CNT, 8.5KG / CNT a i ʻole e like me ka hoʻouna maoli |
| Ka nui o ka pahu pahu | 51×21.5×19.8 knm |
| Nā noi | Ka nānā ʻana i nā mea hana, ka hoʻokele lāʻau lapaʻau, ka nānā ʻana i nā mea kani, nā lako laina hana, IT / Energy Routine Inspection. |